Growing Trend
About lead-free technology:
1. The European Union passed a law in 1998 that made it clear that leaded solder should not be used in any electronic product from January 2004, 1.
2. Beginning in 1997, the National Center for Manufacturing Science (NCMS) lead-free soldering project, conducted jointly by 11 U.S. industry groups and national laboratories, has completed a four-year plan to identify and evaluate alternatives to tin-lead solder, which aims to determine whether leaded solder in electronics manufacturing is safe, reliable, non-toxic and economically viable alternatives.
3. Lead-free targets set by Japanese companies and products for mass production.
|
Company name |
Scope of use |
term |
remark |
| Panasonic |
all |
End of 2002 | |
|
Small MD |
October 1998 |
Reflow soldering: Sn Ag Bi In Fusion welding: Sn Cu (Ni) |
|
|
Cassette recorder |
October 2000 | ||
|
camera |
End of 1999 |
||
|
NEC |
97% off 50 years |
October 2001 |
Some products are mainly Sn-Ag-Cu |
|
all |
October 2002 | ||
| Hitachi |
97% off 50 years |
October 2000 |
Domestic production minus 50%, |
|
Inside the company |
October 2000 |
||
|
Hitachi Group |
October 2004 |
||
|
VCR, refrigerator part |
October 1999 |
||
|
Sweepers, sweepers, air conditioners |
In 2000 |
||
|
Pen and laptop |
In 2000 |
||
|
Sony |
all |
In 2001 |
|
|
VCR |
October 2001 |
Sn-2.5Ag-Bi0.5Cu |
|
|
Toshiba |
Portable mobile phones |
In 2000 |
|
|
Mitsubishi |
50% |
In 2004 |
Four household products |
|
all |
In 2005 |
||
|
Fujitsu |
LSI all |
October 2000 |
|
|
PWB with 50% |
October 2001 |
||
|
all |
October 2002 |
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