H Selective Soldering System
| Equipment parameters | Dimension (LxWxH) |
2450 x 1845x 1565 (mm)/2900 x 2045 x 1560 |
2450 x 2055 x 1665 (mm) |
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| Transport Parameters | Transporwtidth adjustment |
50-460 (mm)/ 50-610 (mm) |
50-350 (mm) |
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|
PCBsize |
510x460 (mm ) /610x610 (mm) |
510 x 350 (mm) |
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| Conveyor height |
900±20(mm) |
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| The solderingsystem | Solder pot |
Electromagnet ic pump t in solder pot |
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| The amountof tin dross |
0.5KG/pot/week x1 |
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| Nitrogenconsumpiton |
1.5- 2m³/h/ pot x 1 |
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| Solder pot numbers |
single track single pot |
single track single pot |
dual tracks dual pots | ||
| Module numbers | one/ two/three module | one/ two/module |
one/ two/ three module |
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