M Selective Soldering System
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Equipment parameters |
Dimension (LxWxH) |
950 x 1780 x 1565 (mm) |
1100 x 1980 x 1565 (mm) |
1700 x 1780 x 1565 (mm) |
2000 x 1980 x 1565 (mm) |
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Transport Parameters |
Transport widthadjustment |
50- 460 (mm) |
50- 610 (mm) |
50- 460 (mm) |
50- 610 (mm) |
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PCB size |
510 x 460 (mm) |
610 x 610 (mm) |
510 x 460 (mm) |
610x610 (mm) |
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Conveyor height |
900 ±20(mm) |
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Thesolderingsystem |
So lder pot |
Electromagnetic pump tin solder pot |
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Solderpot numbers |
single pot dual pots dual pots individual control |
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The amount of tin dross |
0.5KG/ pot / week x1 |
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Nitrogen consumptio |
1.5m³/h/ pot x 1 |
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